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B Grade? A Grade? No internal connection NC? No internal connection? Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

No internal connection TL The output voltage can be set to any value between Vref approximately 2. These devices have a typical output impedance of 0. Active output circuitry provides a very sharp turn-on characteristic, making these devices excellent replacements for Zener diodes in many applications, such as onboard regulation, adjustable power supplies, and switching power supplies.

In addition, low output drift vs temperature ensures good stability over the entire temperature range. Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www. REF ? All component values are nominal. Cathode voltage, VKA see Note 1. A to 10 mA Operating virtual junction temperature, TJ. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

The deviation parameters Vref dev and Iref dev are defined as the differences between the maximum and minimum values obtained over the recommended temperature range. Maximum Vref 10 6 Minimum Vref? TA is the recommended operating free-air temperature range of the device. Figure 1. R1 Figure 3. Graphs FIGURE Reference voltage vs Free-air temperature Reference current vs Free-air temperature Cathode current vs Cathode voltage OFF-state cathode current vs Free-air temperature Ratio of delta reference voltage to delta cathode voltage vs Free-air temperature Equivalent input noise voltage vs Frequency Equivalent input noise voltage over a s period Small-signal voltage amplification vs Frequency Reference impedance vs Frequency Pulse response Stability boundary conditions 5 6 7, 8 9 10 11 12 13 14 15 16 Table 2.

Reference Voltage? I ref? Reference Current? Free-Air Temperature? Cathode Current? Cathode Voltage? V VKA? V Figure 7 Figure 8? Data at high and low temperatures is applicable only within the recommended operating free-air temperature ranges of the various devices. Off-State Cathode Current? Equivalent Input Noise Voltage? F ? F VCC 1? F To Oscilloscope 0. Small-Signal Voltage Amplification?

IKA Output ? Reference Impedance? V ? Load Capacitance? IKA ? The areas under the curves represent conditions that may cause the device to oscillate.

Figure F TL R2 0. Minimum V Figure Precision 5-V 1. Efficient 5-V Precision Regulator 12 V 6. Voltage Monitor 12 V R ? Off On C Figure Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.

Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components.

To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices.

Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications such as life support where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use.

Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.

Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. Samples may or may not be available. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free RoHS Exempt : This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.

TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All linear dimensions are in inches millimeters.

This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. This package can be hermetically sealed with a metal lid. The terminals are gold plated. The center lead is in electrical contact with the thermal tab. Dimensions do not include mold protrusions, not to exceed 0.

Lead dimensions are not controlled within this area 0. Shipping Method: Straight lead option available in bulk pack only. Tape and Reel information for the Format Lead Option package.

All linear dimensions are in millimeters. Body dimensions do not include mold flash or protrusion not to exceed 0,


Texas Instruments TL431ACDBZR









TL431ACDBZR,215 NXP Semiconductors, TL431ACDBZR,215 Datasheet


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